SeekingAlpha · Oct 8, 2026
Besi: Buy The HBM Opportunity Before The Orders Arrive
BESIY remains a Buy: Q2 revenue +69% YoY, strong orders and margins. Hybrid bonding for HBM is the key catalyst.
OTC · BESIY
BE Semiconductor Industries N.V.
Technology · Semiconductors
$196.05
Down-$4.95 (-2.47%)
Updated Oct 13, 2026, 12:37 AM
SID Score
5.2/10
Composite research score
Smart Money
46/100
Neutral
- Market cap
- 12.74B
- P/E ratio
- 63.46
- Dividend yield
- 1.27%
- 52-week range
- $140.07 – $374.33
- Volume
- 11.96K
- Avg. volume
- 1.86K
Price performance · BESIY
BESIY price history
1M range · 20 trading sessions · Daily adjusted prices
Prices through Oct 9, 2026
BESIY closed at $201.00 after 20 trading sessions, down 0.68% for the selected period.
- Last close
- $201.00
- Period change
- -0.68%
- Period low
- $197.00
- Period high
- $231.66
Daily close
View OHLC price history
| Date | Open | High | Low | Close | Volume |
|---|---|---|---|---|---|
| Oct 9, 2026 | $201.57 | $203.69 | $199.77 | $201.00 | 11.96K |
| Oct 8, 2026 | $200.94 | $203.07 | $196.33 | $197.23 | 23.99K |
| Oct 7, 2026 | $198.84 | $198.84 | $193.50 | $197.00 | 27.81K |
| Oct 6, 2026 | $219.23 | $219.40 | $214.50 | $214.76 | 14.54K |
| Oct 5, 2026 | $226.535 | $229.42 | $223.756 | $229.42 | 10.51K |
| Oct 2, 2026 | $219.01 | $235.33 | $219.01 | $231.655 | 7.76K |
| Oct 1, 2026 | $216.3399 | $218.23 | $213.0925 | $216.69 | 12.42K |
| Sep 30, 2026 | $224.13 | $224.13 | $216.73 | $217.14 | 10.71K |
| Sep 29, 2026 | $216.72 | $219.87 | $216.71 | $219.74 | 12.91K |
| Sep 28, 2026 | $210.01 | $217.93 | $210.01 | $212.47 | 12.89K |
| Sep 25, 2026 | $217.00 | $217.00 | $212.96 | $214.92 | 6.78K |
| Sep 24, 2026 | $210.21 | $216.06 | $210.21 | $215.01 | 12.25K |
| Sep 23, 2026 | $220.97 | $220.97 | $211.77 | $216.52 | 9.47K |
| Sep 22, 2026 | $215.43 | $222.71 | $215.43 | $221.99 | 7.99K |
| Sep 21, 2026 | $216.88 | $218.61 | $215.20 | $217.60 | 13.45K |
| Sep 18, 2026 | $213.4825 | $215.34 | $210.996 | $215.20 | 27.51K |
| Sep 17, 2026 | $211.56 | $211.56 | $207.69 | $207.75 | 15.66K |
| Sep 16, 2026 | $211.33 | $211.33 | $201.75 | $203.36 | 10.73K |
| Sep 15, 2026 | $206.42 | $206.425 | $200.79 | $203.325 | 27.77K |
| Sep 14, 2026 | $201.51 | $205.83 | $200.46 | $202.38 | 25.17K |
Latest BESIY news
The latest Smart Investors Daily articles mentioning BESIY.
Stock researchCompany · Overview
Company
Market Activity
Research & News
BESIY research
Overview
Company profile and research snapshot.
Company profile
BE SMCNDCTR INDUS S/ADR
Visit company websiteAnalyst outlook
Consensus and target data currently published for this company.
- Consensus
- —
- Average target
- —
- Implied upside
- —
- Analysts
- —
| Date | Firm | Rating | Target |
|---|---|---|---|
| Sep 23, 2026 | ROTHSCHILD & CO REDBURN | Buy | — |
| Sep 22, 2026 | BNP PARIBAS | Outperform | — |
| Sep 17, 2026 | BAADER EUROPE / ALPHAVALUE | Buy | — |
| Aug 27, 2026 | NEEDHAM & COMPANY INC. | Buy | — |
| Aug 26, 2026 | KBC SECURITIES | Hold | — |
News briefing
No generated briefing is available yet.
Yahoo · Oct 6, 2026
Applied Materials (AMAT) Is Up 11.4% After New AI Chip Memory and Packaging Partnerships Announced
In late September and early October 2026, Applied Materials announced expanded collaborations at its new US$5.00 billion EPIC Center, bringing in KIOXIA to advance next-generation memory and extending its longstanding partnership with BE Semiconductor Industries to co-develop advanced packaging and interconnect technologies for AI-focused chips. This twin push into cutting-edge memory and packaging R&D highlights Applied Materials’ ambition to sit at the center of AI-era chip design and...
Yahoo · Oct 1, 2026
Why Applied Materials (AMAT) Stock Is Up Today
Shares of semiconductor machinery manufacturer Applied Materials (NASDAQ:AMAT) jumped 2.5% in the afternoon session after the company expanded its partnership with BE Semiconductor Industries to develop advanced packaging technologies for artificial intelligence infrastructure.
Yahoo · Oct 1, 2026
Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging for AI Scaling
Besi joins Applied's EPIC Center as an Innovation Partner, extending a collaboration that began in 2020 with the companies' joint Hybrid Bonding Center of Excellence in SingaporeExpanded collaboration targets next-generation 3D IC scaling, logic and memory integration, and photonics applications supporting AI infrastructure build-outPartnership expands beyond die-to-wafer hybrid bonding to new hybrid bonding platforms, scaling of thermo-compression bonding (TCB), and new die-on-wafer, die-on-die
AI research layers
Interpretive context generated from the platform’s current data sources.
No results
AI research layers have not been published yet.
